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Optical interconnect transmitter based on guided-wave silicon optical benchPo-Kuan Shen, Chin-Ta Chen, Chia-Chi Chang, Hsu-Liang Hsiao, Yen-Chung Chang, Sheng-Long Li, Ho-Yen Tsai, Hsiao-Chin Lan, Yun-Chih Lee, and Mount-Learn Wu »View Author Affiliations
Po-Kuan Shen,1
Chin-Ta Chen,1
Chia-Chi Chang,1
Hsu-Liang Hsiao,1
Yen-Chung Chang,1
Sheng-Long Li,1
Ho-Yen Tsai,1
Hsiao-Chin Lan,2
Yun-Chih Lee,3
and Mount-Learn Wu1,*
1Department of Optics and Photonics, National Central University, Jhongli, Taiwan, 32001, Taiwan 2Optical Sciences Center, National Central University, Jhongli, Taiwan, 32001, Taiwan 3Centera Photonics Inc., 3F, No.6-3, Dusing Rd., Hsinchu Science Park, Taiwan 30078, Taiwan *Corresponding author: mlwu@dop.ncu.edu.tw |
Optics Express, Vol. 20, Issue 9, pp. 10382-10392 (2012)
http://dx.doi.org/10.1364/OE.20.010382
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Abstract
An optical interconnect transmitter based on guided-wave silicon optical bench is demonstrated. The guided-wave silicon optical bench (GW-SiOB) is developed on a silicon-on-insulator (SOI) substrate. The three-dimensional guided-wave optical paths on the silicon optical bench are realized using trapezoidal waveguides monolithically integrated with 45° micro-reflectors. Such three-dimensional guided-w ave optical paths of SiOB would simplify and shrink the intra-chip optical interconnects located on a SOI substrate. The clearly open eye patterns operated at a data rate of 5 Gbps verifies the proposed GW-SiOB is suitable for intra-chip optical interconnects.
© 2012 OSA
OCIS Codes
(130.3120) Integrated optics : Integrated optics devices
(200.4650) Optics in computing : Optical interconnects
(230.4040) Optical devices : Mirrors
(130.3990) Integrated optics : Micro-optical devices
ToC Category:
Integrated Optics
History
Original Manuscript: March 7, 2012
Revised Manuscript: April 12, 2012
Manuscript Accepted: April 15, 2012
Published: April 20, 2012
Citation
Po-Kuan Shen, Chin-Ta Chen, Chia-Chi Chang, Hsu-Liang Hsiao, Yen-Chung Chang, Sheng-Long Li, Ho-Yen Tsai, Hsiao-Chin Lan, Yun-Chih Lee, and Mount-Learn Wu, "Optical interconnect transmitter based on guided-wave silicon optical bench," Opt. Express 20, 10382-10392 (2012)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-20-9-10382
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- B. S. Rho, S. Kang, H. S. Cho, H.-H. Park, S.-W. Ha, and B.-H. Rhee, “PCB-compatible optical interconnection using 45 -ended connection rods and via-holed waveguides,” J. Lightwave Technol.22(9), 2128–2134 (2004). [CrossRef]
- B. S. Rho, S. Kang, H. S. Cho, H.-H. Park, S.-W. Ha, and B.-H. Rhee, “PCB-compatible optical interconnection using 45 -ended connection rods and via-holed waveguides,” J. Lightwave Technol.22(9), 2128–2134 (2004). [CrossRef]
- K. B. Yoon, I.-K. Cho, S. H. Ahn, M. Y. Jeong, D. J. Lee, Y. U. Heo, B. S. Rho, H.-H. Park, and B.-H. Rhee, “Optical backplane system using waveguide-embeddded PCBs and optical slots,” J. Lightwave Technol.22(9), 2119–2127 (2004). [CrossRef]
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- L. Vivien, M. Rouvière, J. M. Fédéli, D. Marris-Morini, J. F. Damlencourt, J. Mangeney, P. Crozat, L. El Melhaoui, E. Cassan, X. Le Roux, D. Pascal, and S. Laval, “High speed and high responsivity germanium photodetector integrated in a silicon-on-insulator microwaveguide,” Opt. Express15(15), 9843–9848 (2007). [CrossRef] [PubMed]
- A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett.12(8), 1073–1075 (2000). [CrossRef]
- L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron.12(5), 1032–1044 (2006). [CrossRef]
- L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron.12(5), 1032–1044 (2006). [CrossRef]
- L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron.12(5), 1032–1044 (2006). [CrossRef]
- L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron.12(5), 1032–1044 (2006). [CrossRef]
- J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett.21(8), 522–524 (2009). [CrossRef]
- L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron.12(5), 1032–1044 (2006). [CrossRef]
- H. L. Hsiao, H. C. Lan, C. C. Chang, C. Y. Lee, S. P. Chen, C. H. Hsu, S. F. Chang, Y. S. Lin, F. M. Kuo, J. W. Shi, and M. L. Wu, “Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules based on silicon optical benches with 45 ° micro-reflectors,” Opt. Express17(26), 24250–24260 (2009). [CrossRef] [PubMed]
- D. Kim, J. Shim, Y. C. Keh, and M. Park, “Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver,” IEEE J. Quantum Electron.12(4), 776–782 (2006). [CrossRef]
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- N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett.20(20), 1727–1729 (2008). [CrossRef]
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Appl. Phys. Lett.
- L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett.87(14), 141110 (2005). [CrossRef]
IEEE J. Quantum Electron.
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IEEE J. Sel. Top. Quantum Electron.
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IEEE Photon. Technol. Lett.
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J. Lightwave Technol.
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Opt. Express
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Proc. SPIE
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