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Energy Express

Energy Express

  • Editor: Bernard Kippelen
  • Vol. 20, Iss. S5 — Sep. 10, 2012
  • pp: A597–A605

Cup-shaped copper heat spreader in multi-chip high-power LEDs application

Ray Hua Horng, Hung Lieh Hu, Re Ching Lin, Li Shen Tang, Chen Peng Hsu, and Sin Liang Ou  »View Author Affiliations


Optics Express, Vol. 20, Issue S5, pp. A597-A605 (2012)
http://dx.doi.org/10.1364/OE.20.00A597


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Abstract

In this study, cup-shaped copper sheets were developed to improve heat dispassion for high-power light emitting diodes (LEDs) array module (3 × 3, 4 × 4, and 5 × 5) using an electroplating technique. The cup-shaped copper sheets were directly contacted with sapphire to enhance the heat dissipation of the chip itself. The lateral emitting light extraction and heat dissipation of high-power LEDs were enhanced and efficient. The surface temperature was not only decreasing but also uniform for each LED chip with the cup-shaped copper heat spreader adoption. The high thermal transmitting performance of cup-shaped copper heat spreader allows thermal resistance reducing 0.7, 0.6, and 0.7 K/W of 3 × 3, 4 × 4, and 5 × 5 LED array module, respectively. In addition, the light output power was increased of 14, 13, and 12% with 3 × 3, 4 × 4, and 5 × 5 LEDs array module using cup-shaped copper sheet at high current injection. High heat dissipation performance and light extraction were obtained by cup-shaped copper sheet with copper bulk and silver mirror.

© 2012 OSA

OCIS Codes
(230.3670) Optical devices : Light-emitting diodes
(250.0250) Optoelectronics : Optoelectronics

ToC Category:
Light-Emitting Diodes

History
Original Manuscript: March 28, 2012
Revised Manuscript: June 29, 2012
Manuscript Accepted: June 30, 2012
Published: July 10, 2012

Citation
Ray Hua Horng, Hung Lieh Hu, Re Ching Lin, Li Shen Tang, Chen Peng Hsu, and Sin Liang Ou, "Cup-shaped copper heat spreader in multi-chip high-power LEDs application," Opt. Express 20, A597-A605 (2012)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-20-S5-A597


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References

  1. K. C. Chen, R. W. Chuang, Y. K. Su, C. L. Lin, H. C. Hsu, J. Q. Huang, and K. F. Yang, “High thermal dissipation of ultra high power light-emitting diodes by copper electroplating,” in Proceedings of 57th IEEE Electronic Components and Technology Conference (IEEE, 2007), pp. 734–736.
  2. L. Yuan, S. Liu, M. Chen, and X. Luo, “Thermal analysis of high power LED array packaging with microchannel cooler,” in Proceedings of 7th Electronics Packaging Technology Conference (IEEE, 2006), pp. 1–5.
  3. W. Y. Lin, D. S. Wuu, K. F. Pan, S. H. Huang, C. E. Lee, W. K. Wang, S. C. Hsu, Y. Y. Su, S. Y. Huang, and R. H. Horng, “High-power GaN-mirror-Cu light-emitting diodes for vertical current injection using laser liftoff and electroplating techniques,” IEEE Photon. Technol. Lett.17(9), 1809–1811 (2005). [CrossRef]
  4. T. Tamura, T. Setomoto, and T. Taguchi, “Illumination characteristics of lighting array using 10 candela-class white LEDs under AC 100 V operation,” J. Lumin.87–89, 1180–1182 (2000). [CrossRef]
  5. S. F. Wong, P. Malatkar, C. Rick, V. Kulkarni, and I. Chin, “Vibration testing and analysis of ball grid array package solder joints,” in Proceedings of 57th IEEE Electronic Components and Technology Conference (IEEE, 2007), pp. 373–380.
  6. R. H. Horng, C. C. Chiang, H. Y. Hsiao, X. Zheng, D. S. Wuu, and H. I. Lin, “Improved thermal management of GaN/sapphire light-emitting diodes embedded in reflective heat spreaders,” Appl. Phys. Lett.93(11), 111907 (2008). [CrossRef]
  7. R. H. Horng, H. Y. Hsiao, C. C. Chiang, D. S. Wuu, Y. L. Tsai, and H. I. Lin, “Novel device design for high-power InGaN/sapphire LEDs using copper heat spreader with reflector,” IEEE J. Sel. Top. Quantum Electron.15(4), 1281–1286 (2009). [CrossRef]
  8. R. H. Horng, W. K. Wang, S. Y. Huang, and D. S. Wuu, “Effect of resonant cavity in wafer-bonded green InGaN LED with dielectric and silver mirrors,” IEEE Photon. Technol. Lett.18(3), 457–459 (2006). [CrossRef]
  9. L. Kim, J. H. Choi, S. H. Jang, and M. W. Shin, “Thermal analysis of LED array system with heat pipe,” Thermochim. Acta455(1–2), 21–25 (2006).
  10. L. Kim and M. W. Shin, “Thermal resistance measurement of LED package with multichips,” IEEE Trans. Compon. Packag. Tech.30(4), 632–636 (2007). [CrossRef]
  11. N. Narendran and Y. Gu, “Life of LED-based white light sources,” IEEE Photon. Technol. Lett.1(1), 167–171 (2005).
  12. G. Faekas, Q. V. V. Vader, A. Poppe, and G. Bognar, “Thermal investigation of high power optical device by transient testing,” in Proceedings of 9th International Workshop on Thermal Investigations of ICs and Systems (IEEE, 2003), pp. 213–218.
  13. R. H. Horng, J. S. Hong, Y. L. Tsai, D. S. Wuu, C. M. Chen, and C. J. Chen, “Optimized thermal management from a chip to a heat sink for high-power GaN-based light-emitting diodes,” IEEE Trans. Electron. Dev.57(9), 2203–2207 (2010). [CrossRef]
  14. S. Nakamura, M. Senoh, N. Iwasa, and S. Nagahama, “High‐power InGaN single‐quantum‐well‐structure blue and violet light‐emitting diodes,” Appl. Phys. Lett.67(13), 1868 (1995). [CrossRef]
  15. B. Zhang, T. Egawa, H. Ishikawa, Y. Liu, and T. Jimbo, “Thermal stability of InGaN multiple-quantum-well light-emitting diodes on an AlN/sapphire template,” J. Appl. Phys.95(6), 3170 (2004). [CrossRef]

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