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Optics Express

Optics Express

  • Editor: Andrew M. Weiner
  • Vol. 21, Iss. 14 — Jul. 15, 2013
  • pp: 16657–16662

Fabrication of high-aspect-ratio grooves in silicon using femtosecond laser irradiation and oxygen-dependent acid etching

An Pan, Jinhai Si, Tao Chen, Yuncan Ma, Feng Chen, and Xun Hou  »View Author Affiliations

Optics Express, Vol. 21, Issue 14, pp. 16657-16662 (2013)

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We demonstrated a new method to fabricate micron-sized grooves with high aspect ratios in silicon wafers by combining femtosecond laser irradiation and oxygen-dependent acid etching. Femtosecond laser was employed to induce structure changes and incorporate oxygen into silicon, and then materials in oxygen-containing regions were etched by hydrofluoric acid (HF) solution to form grooves. The etching could be attributed to the reaction between HF and silicon oxides formed by femtosecond laser irradiation. The dependences of the aspect ratios of grooves on the laser fluence and the scanning velocity were also investigated.

© 2013 OSA

OCIS Codes
(160.6000) Materials : Semiconductor materials
(230.4000) Optical devices : Microstructure fabrication
(320.2250) Ultrafast optics : Femtosecond phenomena
(350.3850) Other areas of optics : Materials processing

ToC Category:
Laser Microfabrication

Original Manuscript: May 9, 2013
Revised Manuscript: June 28, 2013
Manuscript Accepted: June 29, 2013
Published: July 3, 2013

An Pan, Jinhai Si, Tao Chen, Yuncan Ma, Feng Chen, and Xun Hou, "Fabrication of high-aspect-ratio grooves in silicon using femtosecond laser irradiation and oxygen-dependent acid etching," Opt. Express 21, 16657-16662 (2013)

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