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Optics Express

Optics Express

  • Editor: Andrew M. Weiner
  • Vol. 21, Iss. 20 — Oct. 7, 2013
  • pp: 23851–23865

Study of heating capacity of focused IR light soldering systems

C. Anguiano, M. Félix, A. Medel, M. Bravo, D. Salazar, and H. Márquez  »View Author Affiliations


Optics Express, Vol. 21, Issue 20, pp. 23851-23865 (2013)
http://dx.doi.org/10.1364/OE.21.023851


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Abstract

An experimental study about four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead-free electronic devices specifically for Ball Grid Arrays (BGA) is presented. An analysis of irradiance and infrared thermography at BGA surface is presented, as well as heat transfer by radiation and conduction process from the surface of the BGA to the solder balls. The results of this work show that the heating provided by our proposed optical setups, measured at the BGA under soldering process, meets the high temperature and uniform thermal distribution requirements, which are defined by the reflow solder method for SMT devices.

© 2013 Optical Society of America

OCIS Codes
(120.0120) Instrumentation, measurement, and metrology : Instrumentation, measurement, and metrology
(120.4820) Instrumentation, measurement, and metrology : Optical systems

ToC Category:
Instrumentation, Measurement, and Metrology

History
Original Manuscript: July 17, 2013
Revised Manuscript: September 16, 2013
Manuscript Accepted: September 17, 2013
Published: September 30, 2013

Citation
C. Anguiano, M. Félix, A. Medel, M. Bravo, D. Salazar, and H. Márquez, "Study of heating capacity of focused IR light soldering systems," Opt. Express 21, 23851-23865 (2013)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-21-20-23851


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