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Optics Express

Optics Express

  • Editor: Andrew M. Weiner
  • Vol. 21, Iss. 3 — Feb. 11, 2013
  • pp: 2978–2986

Low bend loss waveguides enable compact, efficient 3D photonic chips

Alexander Arriola, Simon Gross, Nemanja Jovanovic, Ned Charles, Peter G. Tuthill, Santiago M. Olaizola, Alexander Fuerbach, and Michael J. Withford  »View Author Affiliations


Optics Express, Vol. 21, Issue 3, pp. 2978-2986 (2013)
http://dx.doi.org/10.1364/OE.21.002978


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Abstract

We present a novel method to fabricate low bend loss femtosecond-laser written waveguides that exploits the differential thermal stabilities of laser induced refractive index modifications. The technique consists of a two-step process; the first involves fabricating large multimode waveguides, while the second step consists of a thermal post-annealing process, which erases the outer ring of the refractive index profile, enabling single mode operation in the C-band. By using this procedure we report waveguides with sharp bends (down to 16.6 mm radius) and high (80%) normalized throughputs. This procedure was used to fabricate an efficient 3D, photonic device known as a “pupil-remapper” with negligible bend losses for the first time. The process will also allow for complex chips, based on 10's - 100's of waveguides to be realized in a compact foot print with short fabrication times.

© 2013 OSA

OCIS Codes
(130.3120) Integrated optics : Integrated optics devices
(140.3390) Lasers and laser optics : Laser materials processing
(220.4000) Optical design and fabrication : Microstructure fabrication
(350.1260) Other areas of optics : Astronomical optics
(130.2755) Integrated optics : Glass waveguides

ToC Category:
Integrated Optics

History
Original Manuscript: November 23, 2012
Revised Manuscript: January 10, 2013
Manuscript Accepted: January 11, 2013
Published: January 31, 2013

Citation
Alexander Arriola, Simon Gross, Nemanja Jovanovic, Ned Charles, Peter G. Tuthill, Santiago M. Olaizola, Alexander Fuerbach, and Michael J. Withford, "Low bend loss waveguides enable compact, efficient 3D photonic chips," Opt. Express 21, 2978-2986 (2013)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-21-3-2978


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