Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Journal Home About Issues in Progress Current Issue All Issues Feature Issues

A novel integrated structure of thin film GaN LED with ultra-low thermal resistance

Shih-Yi Wen, Hung-Lieh Hu, Yao-Jun Tsai, Chen-Peng Hsu, Re-Ching Lin, and Ray Hua Horng

Open Access Open Access

Abstract

This study proposes a novel packaging structure for vertical thin-GaN LED applications by integration of LED chip and silicon-based packaging process. The vertical thin film LED is directly mounted on package submount. The shortest thermal path structure from junction to package submount achieves the lowest thermal resistance of 1.65 K/W for LED package. Experimental results indicate that low thermal resistance significant improved forward current up to 4.6A with 1.125 × 1.125 mm2 LED chip size.

© 2014 Optical Society of America

Full Article  |  PDF Article

Corrections

Shih-Yi Wen, Hung-Lieh Hu, Yao-Jun Tsai, Chen-Peng Hsu, Re-Ching Lin, and Ray Hua Horng, "A novel integrated structure of thin film GaN LED with ultra-low thermal resistance: erratum," Opt. Express 22, A960-A960 (2014)
https://opg.optica.org/oe/abstract.cfm?uri=oe-22-S3-A960
More Like This
Packaged structure optimization for enhanced light extraction efficiency and reduced thermal resistance of ultraviolet B LEDs

Chun Nien Liu, Chia Chun Hu, Yang Jun Zheng, Yu Fu Hsu, and Zhi Ting Ye
Opt. Express 32(7) 12438-12448 (2024)

A novel integrated structure of thin film GaN LED with ultra-low thermal resistance: erratum

Shih-Yi Wen, Hung-Lieh Hu, Yao-Jun Tsai, Chen-Peng Hsu, Re-Ching Lin, and Ray Hua Horng
Opt. Express 22(S3) A960-A960 (2014)

Performance improvement of vertical ultraviolet -LEDs with AlSi alloy substrates

Kung-Cheng Chen, Shih-Yung Huang, Wei-Kai Wang, and Ray-Hua Horng
Opt. Express 23(12) 15452-15458 (2015)

View More...

Cited By

Optica participates in Crossref's Cited-By Linking service. Citing articles from Optica Publishing Group journals and other participating publishers are listed here.

Alert me when this article is cited.


Figures (6)
Fig. 1
Fig. 1 Schematic diagram of TFP LED structure.

Download Full Size | PDF

Fig. 2
Fig. 2 Integration packaging process flow of TFP LED, (a) chip to wafer eutectic bonding, (b) laser lift-off and Ga remove, (c) U-GaN etching, (d) N-pad metallization, (e) wire bonding and (f) lens molding and singulation.

Download Full Size | PDF

Fig. 3
Fig. 3 Photograph of the fabricated TFP LED.

Download Full Size | PDF

Fig. 4
Fig. 4 Results of leakage current test of multiple TFP LEDs on packaging submount.

Download Full Size | PDF

Fig. 5
Fig. 5 Thermal resistance measured by T3ster (a) TFP with direct eutectic bonding; (b) TFP with flux eutectic bonding; (c) commercial face-up LED package and (d) commercial thin-GaN LED package.

Download Full Size | PDF

Fig. 6
Fig. 6 Test results of normalized light output power of TFP and commercial high power LED packages.

Download Full Size | PDF

Tables (1)

Tables Icon

Table 1 Shear force test results of different eutectic bonding process.

View Table
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use