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Optics Express

Optics Express

  • Editor: Andrew M. Weiner
  • Vol. 22, Iss. 7 — Apr. 7, 2014
  • pp: 8451–8459

Feedback tolerance of DFB laser for silicon photonics packaging

Seiji Takeda and Shigeru Nakagawa  »View Author Affiliations

Optics Express, Vol. 22, Issue 7, pp. 8451-8459 (2014)

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Silicon photonics packaging without optical isolator is of significant importance to realize low fabrication cost and small device size. In this report, impact of external feedback on DFB laser performance is investigated both theoretically and experimentally. Dynamic transfer matrix method and rate equation model are coupled to describe the dynamic interaction between optical field and carriers in a DFB structure under the feedback by external reflection. The calculation model exhibits laser spectrum splits and output intensity fluctuates with increase of the degree of external feedback, in good agreement with experimental results. The theoretical analysis is performed under various feedback parameters, and the optimum packaging condition for DFB laser chip in silicon photonics is guided.

© 2014 Optical Society of America

OCIS Codes
(130.0250) Integrated optics : Optoelectronics
(130.3130) Integrated optics : Integrated optics materials
(200.4650) Optics in computing : Optical interconnects
(250.5960) Optoelectronics : Semiconductor lasers

ToC Category:
Lasers and Laser Optics

Original Manuscript: December 30, 2013
Revised Manuscript: March 17, 2014
Manuscript Accepted: March 23, 2014
Published: April 2, 2014

Seiji Takeda and Shigeru Nakagawa, "Feedback tolerance of DFB laser for silicon photonics packaging," Opt. Express 22, 8451-8459 (2014)

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