1.12 Tb/s superchannel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC)

doi:10.1364/OE.19.00B154

1.12 Tb/s superchannel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC)

P. Evans, M. Fisher, R. Malendevich, A. James, G. Goldfarb, T. Vallaitis, M. Kato, P. Samra, S. Corzine, E. Strzelecka, P. Studenkov, R. Salvatore, F. Sedgwick, M. Kuntz, V. Lal, D. Lambert, A. Dentai, D. Pavinski, J. Zhang, J. Cornelius, T. Tsai, B. Behnia, J. Bostak, V. Dominic, A. Nilsson, B. Taylor, J. Rahn, S. Sanders, H. Sun, K.-T. Wu, J. Pleumeekers, R. Muthiah, M. Missey, R. Schneider, J. Stewart, M. Reffle, T. Butrie, R. Nagarajan, M. Ziari, F. Kish, and D. Welch »View Author Affiliations

Optics Express, Vol. 19, Issue 26, pp. B154-B158 (2011)
http://dx.doi.org/10.1364/OE.19.00B154

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▸ Article Outline
– Abstract
1. Introduction
2. PIC Design
3. Performance
3. Conclusion
– References and links

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Abstract

In this work, a 10-wavelength, polarization-multiplexed, monolithically integrated InP coherent QPSK transmitter PIC is demonstrated to operate at 112 Gb/sec per wavelength and total chip superchannel bandwidth of 1.12 Tb/s. This demonstration suggests that increasing data capacity to multi-Tb/s per chip is possible and likely in the future.

1. Introduction

Photonic integration is critical to the practical realization of high-bandwidth, phase-sensitive modulation schemes based on coherent detection (e.g, quadrature phase-shift keying, QPSK). Element counts of large-scale photonic integrated circuits employing these complex phase-modulation schemes are significantly higher than those of on-off keying (OOK) chips utilizing electroabsorption modulators due to the requirement of multiple data streams per channel as well as the need to control phase and amplitude throughout the optical circuit. We have previously reported a PM-DQPSK 10-wavelength transmitter PIC operating at 456 Gb/s (45.6Gb/s/λ) employing over 400 elements per PIC [1

S. Corzine, P. Evans, M. Fisher, J. Gheorma, M. Kato, V. Dominic, P. Samra, A. Nilsson, J. Rahn, I. Lyubomirsky, A. Dentai, P. Studenkov, M. Missey, D. Lambert, A. Spannagel, R. Muthiah, R. Salvatore, S. Murthy, E. Strzelecka, J. L. Pleumeekers, A. Chen, R. Schneider, R. Nagarajan, M. Ziari, J. Stewart, C. H. Joyner, F. Kish, and D. F. Welch, “Large-scale InP transmitter PICs for PM-DQPSK fiber transmission systems,” IEEE Phont. Technol. Lett. 22(14), 1015–1017 (2010). [CrossRef]

]. We have also demonstrated a 10-channel Rx PIC module operating at 112Gb/s/λ with a total superchannel bandwidth of 1.12Tb/s [2

R. Nagarajan, D. Lambert, M. Kato, V. Lal, G. Goldfarb, J. Rahn, M. Kuntz, J. Pleumeekers, A. Dentai, H.-S. Tsai, R. Malendevich, M. Missey, K.-T. Wu, H. Sun, J. McNicol, J. Tang, J. Zhang, T. Butrie, A. Nilsson, M. Reffle, F. Kish, and D. Welch , “10 channel, 100Gbit/s per channel, dual polarization, coherent QPSK, monolithic InP receiver photonic integrated circuit,” in Proc. Optical Fiber Communications Conference, Los Angeles, CA, OML4, (2011).

]. Others have recently reported single nested InP IQ modulators for operation at high bandwidths using travelling-wave electrodes with 50Ω terminations [3

N. Kikuchi, Y. Shibata, K. Tsuzuki, H. Sanjoh, T. Sato, E. Yamada, T. Ishibashi, and H. Yasaka, “80-Gb/s low-driving-voltage InP DQPSK modulator with an n-p-i-n structure,” IEEE Photon. Technol. Lett. 21(12), 787–789 (2009). [CrossRef]

, 4

K. Prosyk, T. Brast, M. Gruner, M. Hamacher, D. Hoffmann, R. Millett, and K.-O. Velthaus, “Tunable InP-based optical IQ modulator for 160 Gb/s,” in Proc. European Conference on Optical Communication, Geneva, Switzerland, TH13A5, (2011).

]. This work reports on the integration of 20 high-bandwidth nested InP modulators for PM-QPSK operation at 112 Gb/s/λ, corresponding to a total superchannel bandwith of 1.12 Tb/s on a single monolithic chip. Superchannels are very important for high-capacity long-haul optical telecommunications systems as they enable a pool of bandwidth to be switched or groomed to form a single line-card with multiple carriers on the card, resulting in substantial improvements in the efficiency of the utilization of the transmission bandwidth.

In this paper, we describe the first demonstration of a 1.12 Tb/s superchannel coherent PM-QPSK, transmitter PIC with a 1.12 Tb/s Rx PIC module, representing a ~2x increase in RF modulator bandwidth and overall Tx PIC data rate capability. This Tx PIC architecture is enabled by integration of over 450 other integrated circuit elements (including 10 narrow linewidth tunable lasers), similar to our prior Tx PICs [1

, 5

F.A. Kish, D. Welch, R. Nagarajan, J. L. Pleumeekers, V. Lal, M. Ziari, A. Nilsson, M. Kato, S. Murthy, P. Evans, S. W. Corzine, M. Mitchell, P. Samra, M. Missey, S. DeMars, R. P. Schneider, M. S. Reffle, T. Butrie, J. T. Rahn, M. Van Leeuwen, J. W. Stewart, D. J. Lambert, R. C. Muthiah, H. Tsai, J. S. Bostak, A. Dentai, K. Wu, H. Sun, D. J. Pavinski, J. Zhang, J. Tang, J. McNicol, J. M. Kuntz, V. Dominic, B. D. Taylor, and R. A. SalvatoreM. Fisher, A. Spannagel, E. Strzelecka, P. Studenkov, M. Raburn, W. Williams, D. Christini, K. K. Thomson, S. S. Agashe, R. Malendevich, G. Goldfarb, S. Melle, C. Joyner, M. Kaufman, and S. G. Grubb, “Current status of large-scale InP photonic integrated circuits,” IEEE J. Sel. Topics Quant. Electron. PP99) 1–20 (2011). [CrossRef]

], with a key difference that it employs improved performance, high-bandwidth Mach-Zehnder modulators. This achievement is part of a larger trend in integrated photonics wherein the scaling of data capacity per chip for InP-based transmitters utilized in commercial networks has doubled every two years on average since 1995, as shown in Fig. 1 [5

Fig. 1 Data capacity per chip vs. time. InP-based transmitter chips have enabled a continued progression of data capacity doubling in telecommunication networks roughly every 2 years since 1995.

2. PIC Design

The transmitter PIC integrates 10 DFB lasers that each supply 2 optical paths operating in the TE polarization, functionally labeled TE or TM in Fig. 2 to indicate different data paths that will be multiplexed orthogonally off-chip. The 10-wavelength chip operates at 200 GHz channel spacing and covers half of the C-band. A system-level implementation for this device would include downstream interleaving / multiplexing of similar transmitters to achieve a high-spectral efficiency grid spaced by the baud rate (or lower). Alternatively, the channels on a single PIC may also be spaced contiguously to form a superchannel [6

M. Kato, R. Malendevich, D. Lambert, M. Kuntz, A. Damle, V. Lal, A. G. Dentai, O. Khayam, R. Nagarajan, J. Tang, J. Zhang, H.-S. Tsai, T. Butrie, M. Missey, J. Rahn, D. J. Krause, J. McNicol, K.-T. Wu, H. Sun, M. Reffle, F. A. Kish, and D. F. Welch, “10 Channel, 28 Gbaud PM-QPSK, monolithic InP terabit superchannel receiver PIC,” IEEE Photonics Conference paper TuR 3, Arlington (VA), USA, October 2011.

]. Each optical path first enters an array of 2-stage nested Mach-Zehnder modulators (MZM). The PIC chip therefore has 20 super-MZM paths and 40 sub-MZM paths with an RF electrode in each of the sub-MZM paths. DC control elements are used as shown to balance the modulators. Phase-adjustment control elements are similar to RF electrodes except longer and without allowance for high speed operation. Variable optical attenuators (VOA) are used to enable power equalization for each wavelength and polarization. The modulated optical data streams for the 10 wavelengths of each polarization path are multiplexed using an arrayed waveguide grating (AWG) integrated on the chip. The AWG outputs are fiber-coupled and multiplexed off-chip with a polarization beam combiner (PBC).

Fig. 2 Schematic of PIC. The functional blocks of the modulator section consisting of a nested Mach-Zehnder-Modulator for each polarization is shown on the left.

3. Performance

The DC performance of the sub-MZMs is characterized by scanning the RF electrode biases along the RF path and measuring the power transfer function. Excellent uniformity is demonstrated in Fig. 3(a) where we show the superimposed power transfer functions of all 40 sub-MZMs on one PIC. A V_π of 2.6V and DC extinction ratios derived from Fig. 3(a) in excess of 32dB across all 40 sub-MZMs is achieved, as shown in Fig. 3(b) with a median ER>38dB. These high extinction ratios imply a power imbalance between MZ arms of <0.5dB which has negligible impact on system performance. Overall, the results indicate uniform and high extinction ratio performance for integrated InP modulators that compare favorably with conventional discrete modulators.

Fig. 3 (a) 40 MZM DC power transfer functions vs. the push-pull voltage on one arm about the central bias point and (b) cumulative distribution plot of all 40 sub-MZM extinction ratios, each exceeding 30dB on the Tx PIC.

The modulator bandwidth has been characterized using S21 measurements and is shown in Fig. 4 . The measurement used an Agilent 8703B lightwave component analyzer (LCA) and a 50 Ohm terminated RF probe is used to couple the electrical stimulus signal into the modulator section on the chip. The optical signal from the chip is amplified in an EDFA before entering the optical detection section of the LCA. The setup was calibrated to account for the RF probe and optical detection frequency dependence. The measured bandwidth is larger than the maximum 20GHz frequency of the LCA. From the measured transfer function and separate characterization of S11 properties using an unterminated RF probe, we extrapolate a 3dB modulation bandwidth of > 25GHz. This bandwidth is significantly higher than our previously reported 3dB modulation bandwidth of 15GHz on previous generations of Tx PICs [1

] and was achieved by trading off increased common-mode bias on the RF electrodes for reduced modulator length.

Fig. 4 S21 EO response of PIC modulator vs. frequency.

Another key requirement for coherent communication is low spectral phase noise or narrow linewidth. The power spectral density or noise spectra for the DFB of the transmitter PIC is measured by converting frequency noise to amplitude noise in an interferometer for all the channels of the PIC. The measured noise corresponds to a linewidth of approximately 1 MHz for the 10 DFB channels and meets the performance demands of 112 Gb/s operation of ultra-long haul links. Driving the DFBs at higher operating currents, optimizing the active region, and taking care to minimize feedback from downstream elements and the facet have enabled this linewidth performance.

The RF performance of a standalone transmitter PIC was characterized for 1.12 Tb/s operation. In this experiment, the two RF data streams were constructed using a 28 Gb/s pattern generator with a 2¹⁵ −1 PRBS pattern and applied to the chip using multiple ground-signal-signal-ground RF probes. The RF signal was applied first to the TE and then the TM polarization of one wavelength on the PIC. The optical receiver used to characterize the device was a 1.12 Tb/s 10-channel receiver PIC module [2

]. For each polarization, the optical signal was split, delayed and recombined to generate polarization-multiplexed inputs to the receiver module. Figure 5 shows the back-to-back constellation diagram for four data streams (I-TE, Q-TE, I-TM, Q-TM) at 28 Gbaud per stream, or 112 Gb/s per wavelength. Operation better than the FEC limit was demonstrated for every channel. The top row for each channel shows the four possible symbol states associated with the TE polarization of each channel’s QPSK I and Q data streams while the bottom row shows the corresponding TM polarization symbol states.

Fig. 5 28 Gbaud constellation diagrams representing the four data streams for each polarization of every wavelength of a 10-wavelength transmitter PIC.

3. Conclusion

We report the first demonstration of a 10-wavelength PM-QPSK transmitter PIC capable of 1.12 Tb/s superchannel operation (112 Gb/s per wavelength), more than doubling the capacity of 10-wavelength Tx PICs reported previously. Additionally, we estimate the transmission function EO (S21) bandwidth to be in excess of 25GHz, nearly twice our prior performance of phase-modulated chips. The results demonstrate record bandwidth operation of transmitter photonic integrated circuits. Moreover, they show the feasibility and pathway for multi-terabit superchannel transmitters and receivers which should enable the data capacity of the optical devices used in the telecommunications networks to continue to double approximately every two years.

References and links

1.	S. Corzine, P. Evans, M. Fisher, J. Gheorma, M. Kato, V. Dominic, P. Samra, A. Nilsson, J. Rahn, I. Lyubomirsky, A. Dentai, P. Studenkov, M. Missey, D. Lambert, A. Spannagel, R. Muthiah, R. Salvatore, S. Murthy, E. Strzelecka, J. L. Pleumeekers, A. Chen, R. Schneider, R. Nagarajan, M. Ziari, J. Stewart, C. H. Joyner, F. Kish, and D. F. Welch, “Large-scale InP transmitter PICs for PM-DQPSK fiber transmission systems,” IEEE Phont. Technol. Lett. 22(14), 1015–1017 (2010). [CrossRef]
2.	R. Nagarajan, D. Lambert, M. Kato, V. Lal, G. Goldfarb, J. Rahn, M. Kuntz, J. Pleumeekers, A. Dentai, H.-S. Tsai, R. Malendevich, M. Missey, K.-T. Wu, H. Sun, J. McNicol, J. Tang, J. Zhang, T. Butrie, A. Nilsson, M. Reffle, F. Kish, and D. Welch , “10 channel, 100Gbit/s per channel, dual polarization, coherent QPSK, monolithic InP receiver photonic integrated circuit,” in Proc. Optical Fiber Communications Conference, Los Angeles, CA, OML4, (2011).
3.	N. Kikuchi, Y. Shibata, K. Tsuzuki, H. Sanjoh, T. Sato, E. Yamada, T. Ishibashi, and H. Yasaka, “80-Gb/s low-driving-voltage InP DQPSK modulator with an n-p-i-n structure,” IEEE Photon. Technol. Lett. 21(12), 787–789 (2009). [CrossRef]
4.	K. Prosyk, T. Brast, M. Gruner, M. Hamacher, D. Hoffmann, R. Millett, and K.-O. Velthaus, “Tunable InP-based optical IQ modulator for 160 Gb/s,” in Proc. European Conference on Optical Communication, Geneva, Switzerland, TH13A5, (2011).
5.	F.A. Kish, D. Welch, R. Nagarajan, J. L. Pleumeekers, V. Lal, M. Ziari, A. Nilsson, M. Kato, S. Murthy, P. Evans, S. W. Corzine, M. Mitchell, P. Samra, M. Missey, S. DeMars, R. P. Schneider, M. S. Reffle, T. Butrie, J. T. Rahn, M. Van Leeuwen, J. W. Stewart, D. J. Lambert, R. C. Muthiah, H. Tsai, J. S. Bostak, A. Dentai, K. Wu, H. Sun, D. J. Pavinski, J. Zhang, J. Tang, J. McNicol, J. M. Kuntz, V. Dominic, B. D. Taylor, and R. A. SalvatoreM. Fisher, A. Spannagel, E. Strzelecka, P. Studenkov, M. Raburn, W. Williams, D. Christini, K. K. Thomson, S. S. Agashe, R. Malendevich, G. Goldfarb, S. Melle, C. Joyner, M. Kaufman, and S. G. Grubb, “Current status of large-scale InP photonic integrated circuits,” IEEE J. Sel. Topics Quant. Electron. PP99) 1–20 (2011). [CrossRef]
6.	M. Kato, R. Malendevich, D. Lambert, M. Kuntz, A. Damle, V. Lal, A. G. Dentai, O. Khayam, R. Nagarajan, J. Tang, J. Zhang, H.-S. Tsai, T. Butrie, M. Missey, J. Rahn, D. J. Krause, J. McNicol, K.-T. Wu, H. Sun, M. Reffle, F. A. Kish, and D. F. Welch, “10 Channel, 28 Gbaud PM-QPSK, monolithic InP terabit superchannel receiver PIC,” IEEE Photonics Conference paper TuR 3, Arlington (VA), USA, October 2011.

OCIS Codes
(060.1660) Fiber optics and optical communications : Coherent communications
(060.5060) Fiber optics and optical communications : Phase modulation
(250.5300) Optoelectronics : Photonic integrated circuits

ToC Category:
Waveguide and Opto-Electronic Devices

History
Original Manuscript: October 3, 2011
Revised Manuscript: November 3, 2011
Manuscript Accepted: November 4, 2011
Published: November 17, 2011

Virtual Issues
European Conference on Optical Communication 2011 (2011) Optics Express

Citation
P. Evans, M. Fisher, R. Malendevich, A. James, G. Goldfarb, T. Vallaitis, M. Kato, P. Samra, S. Corzine, E. Strzelecka, P. Studenkov, R. Salvatore, F. Sedgwick, M. Kuntz, V. Lal, D. Lambert, A. Dentai, D. Pavinski, J. Zhang, J. Cornelius, T. Tsai, B. Behnia, J. Bostak, V. Dominic, A. Nilsson, B. Taylor, J. Rahn, S. Sanders, H. Sun, K.-T. Wu, J. Pleumeekers, R. Muthiah, M. Missey, R. Schneider, J. Stewart, M. Reffle, T. Butrie, R. Nagarajan, M. Ziari, F. Kish, and D. Welch, "1.12 Tb/s superchannel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC)," Opt. Express 19, B154-B158 (2011)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-19-26-B154

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References

S. Corzine, P. Evans, M. Fisher, J. Gheorma, M. Kato, V. Dominic, P. Samra, A. Nilsson, J. Rahn, I. Lyubomirsky, A. Dentai, P. Studenkov, M. Missey, D. Lambert, A. Spannagel, R. Muthiah, R. Salvatore, S. Murthy, E. Strzelecka, J. L. Pleumeekers, A. Chen, R. Schneider, R. Nagarajan, M. Ziari, J. Stewart, C. H. Joyner, F. Kish, and D. F. Welch, “Large-scale InP transmitter PICs for PM-DQPSK fiber transmission systems,” IEEE Phont. Technol. Lett.22(14), 1015–1017 (2010). [CrossRef]
R. Nagarajan, D. Lambert , M. Kato , V. Lal , G. Goldfarb , J. Rahn , M. Kuntz , J. Pleumeekers , A. Dentai , H.-S. Tsai , R. Malendevich , M. Missey , K.-T. Wu , H. Sun , J. McNicol , J. Tang , J. Zhang , T. Butrie , A. Nilsson , M. Reffle , F. Kish , and D. Welch , “10 channel, 100Gbit/s per channel, dual polarization, coherent QPSK, monolithic InP receiver photonic integrated circuit,” in Proc. Optical Fiber Communications Conference, Los Angeles, CA, OML4, (2011).
N. Kikuchi, Y. Shibata, K. Tsuzuki, H. Sanjoh, T. Sato, E. Yamada, T. Ishibashi, and H. Yasaka, “80-Gb/s low-driving-voltage InP DQPSK modulator with an n-p-i-n structure,” IEEE Photon. Technol. Lett.21(12), 787–789 (2009). [CrossRef]
K. Prosyk, T. Brast , M. Gruner , M. Hamacher , D. Hoffmann , R. Millett , and K.-O. Velthaus , “Tunable InP-based optical IQ modulator for 160 Gb/s,” in Proc. European Conference on Optical Communication, Geneva, Switzerland, TH13A5, (2011).
F.A. Kish, D. Welch, R. Nagarajan, J. L. Pleumeekers, V. Lal, M. Ziari, A. Nilsson, M. Kato, S. Murthy, P. Evans, S. W. Corzine, M. Mitchell, P. Samra, M. Missey, S. DeMars, R. P. Schneider, M. S. Reffle, T. Butrie, J. T. Rahn, M. Van Leeuwen, J. W. Stewart, D. J. Lambert, R. C. Muthiah, H. Tsai, J. S. Bostak, A. Dentai, K. Wu, H. Sun, D. J. Pavinski, J. Zhang, J. Tang, J. McNicol, J. M. Kuntz, V. Dominic, B. D. Taylor, and R. A. SalvatoreM. Fisher, A. Spannagel, E. Strzelecka, P. Studenkov, M. Raburn, W. Williams, D. Christini, K. K. Thomson, S. S. Agashe, R. Malendevich, G. Goldfarb, S. Melle, C. Joyner, M. Kaufman, and S. G. Grubb, “Current status of large-scale InP photonic integrated circuits,” IEEE J. Sel. Topics Quant. Electron.PP99) 1–20 (2011). [CrossRef]
M. Kato, R. Malendevich, D. Lambert, M. Kuntz, A. Damle, V. Lal, A. G. Dentai, O. Khayam, R. Nagarajan, J. Tang, J. Zhang, H.-S. Tsai, T. Butrie, M. Missey, J. Rahn, D. J. Krause, J. McNicol, K.-T. Wu, H. Sun, M. Reffle, F. A. Kish, and D. F. Welch, “10 Channel, 28 Gbaud PM-QPSK, monolithic InP terabit superchannel receiver PIC,” IEEE Photonics Conference paper TuR 3, Arlington (VA), USA, October 2011.

Agashe, S. S.
Bostak, J. S.
Butrie, T.
Chen, A.
Christini, D.
Corzine, S.
Corzine, S. W.
DeMars, S.
Dentai, A.
Dominic, V.
Evans, P.
Fisher, M.
Gheorma, J.
Goldfarb, G.
Grubb, S. G.
Ishibashi, T.
Joyner, C.
Joyner, C. H.
Kato, M.
Kaufman, M.
Kikuchi, N.
Kish, F.
Kish, F.A.
Kuntz, J. M.
Lal, V.
Lambert, D.
Lambert, D. J.
Lyubomirsky, I.
Malendevich, R.
McNicol, J.
Melle, S.
Missey, M.
Mitchell, M.
Murthy, S.
Muthiah, R.
Muthiah, R. C.
Nagarajan, R.
Nilsson, A.
Pavinski, D. J.
Pleumeekers, J. L.
Raburn, M.
Rahn, J.
Rahn, J. T.
Reffle, M. S.
Salvator, R. A.
Salvatore, R.
Samra, P.
Sanjoh, H.
Sato, T.
Schneider, R.
Schneider, R. P.
Shibata, Y.
Spannagel, A.
Stewart, J.
Stewart, J. W.
Strzelecka, E.
Studenkov, P.
Sun, H.
Tang, J.
Taylor, B. D.
Thomson, K. K.
Tsai, H.
Tsuzuki, K.
Van Leeuwen, M.
Welch, D.
Welch, D. F.
Williams, W.
Wu, K.
Yamada, E.
Yasaka, H.
Zhang, J.
Ziari, M.

IEEE Phont. Technol. Lett.

S. Corzine, P. Evans, M. Fisher, J. Gheorma, M. Kato, V. Dominic, P. Samra, A. Nilsson, J. Rahn, I. Lyubomirsky, A. Dentai, P. Studenkov, M. Missey, D. Lambert, A. Spannagel, R. Muthiah, R. Salvatore, S. Murthy, E. Strzelecka, J. L. Pleumeekers, A. Chen, R. Schneider, R. Nagarajan, M. Ziari, J. Stewart, C. H. Joyner, F. Kish, and D. F. Welch, “Large-scale InP transmitter PICs for PM-DQPSK fiber transmission systems,” IEEE Phont. Technol. Lett.22(14), 1015–1017 (2010). [CrossRef]

IEEE Photon. Technol. Lett.

N. Kikuchi, Y. Shibata, K. Tsuzuki, H. Sanjoh, T. Sato, E. Yamada, T. Ishibashi, and H. Yasaka, “80-Gb/s low-driving-voltage InP DQPSK modulator with an n-p-i-n structure,” IEEE Photon. Technol. Lett.21(12), 787–789 (2009). [CrossRef]

Other

K. Prosyk, T. Brast , M. Gruner , M. Hamacher , D. Hoffmann , R. Millett , and K.-O. Velthaus , “Tunable InP-based optical IQ modulator for 160 Gb/s,” in Proc. European Conference on Optical Communication, Geneva, Switzerland, TH13A5, (2011).
F.A. Kish, D. Welch, R. Nagarajan, J. L. Pleumeekers, V. Lal, M. Ziari, A. Nilsson, M. Kato, S. Murthy, P. Evans, S. W. Corzine, M. Mitchell, P. Samra, M. Missey, S. DeMars, R. P. Schneider, M. S. Reffle, T. Butrie, J. T. Rahn, M. Van Leeuwen, J. W. Stewart, D. J. Lambert, R. C. Muthiah, H. Tsai, J. S. Bostak, A. Dentai, K. Wu, H. Sun, D. J. Pavinski, J. Zhang, J. Tang, J. McNicol, J. M. Kuntz, V. Dominic, B. D. Taylor, and R. A. SalvatoreM. Fisher, A. Spannagel, E. Strzelecka, P. Studenkov, M. Raburn, W. Williams, D. Christini, K. K. Thomson, S. S. Agashe, R. Malendevich, G. Goldfarb, S. Melle, C. Joyner, M. Kaufman, and S. G. Grubb, “Current status of large-scale InP photonic integrated circuits,” IEEE J. Sel. Topics Quant. Electron.PP99) 1–20 (2011). [CrossRef]
M. Kato, R. Malendevich, D. Lambert, M. Kuntz, A. Damle, V. Lal, A. G. Dentai, O. Khayam, R. Nagarajan, J. Tang, J. Zhang, H.-S. Tsai, T. Butrie, M. Missey, J. Rahn, D. J. Krause, J. McNicol, K.-T. Wu, H. Sun, M. Reffle, F. A. Kish, and D. F. Welch, “10 Channel, 28 Gbaud PM-QPSK, monolithic InP terabit superchannel receiver PIC,” IEEE Photonics Conference paper TuR 3, Arlington (VA), USA, October 2011.
R. Nagarajan, D. Lambert , M. Kato , V. Lal , G. Goldfarb , J. Rahn , M. Kuntz , J. Pleumeekers , A. Dentai , H.-S. Tsai , R. Malendevich , M. Missey , K.-T. Wu , H. Sun , J. McNicol , J. Tang , J. Zhang , T. Butrie , A. Nilsson , M. Reffle , F. Kish , and D. Welch , “10 channel, 100Gbit/s per channel, dual polarization, coherent QPSK, monolithic InP receiver photonic integrated circuit,” in Proc. Optical Fiber Communications Conference, Los Angeles, CA, OML4, (2011).

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