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Optics Letters

Optics Letters


  • Vol. 25, Iss. 17 — Sep. 1, 2000
  • pp: 1285–1287

Massively parallel low-cost pick-and-place of optoelectronic devices by electrochemical fluidic processing

Mihrimah Ozkan, Osman Kibar, Cengiz S. Ozkan, and Sadik C. Esener  »View Author Affiliations

Optics Letters, Vol. 25, Issue 17, pp. 1285-1287 (2000)

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We describe a novel electrochemical technique for the nonlithographic, fluidic pick-and-place assembly of optoelectronic devices by electrical and optical addressing. An electrochemical cell was developed that consists of indium tin oxide (ITO) and n -type silicon substrates as the two electrode materials and deionized water (R = 18 MΩ) as the electrolytic medium between the two electrodes. 0.8–20-µm-diameter negatively charged polystyrene beads, 50–100-µm-diameter SiO2 pucks, and 50-µm LED's were successfully integrated upon a patterned silicon substrate by electrical addressing. In addition, 0.8-µm-diameter beads were integrated upon a homogeneous silicon substrate by optical addressing. This method can be applied to massively parallel assembly (>1000 × 1000 arrays) of multiple types of devices (of a wide size range) with very fast (a few seconds) and accurate positioning.

© 2000 Optical Society of America

OCIS Codes
(230.0250) Optical devices : Optoelectronics

Mihrimah Ozkan, Osman Kibar, Cengiz S. Ozkan, and Sadik C. Esener, "Massively parallel low-cost pick-and-place of optoelectronic devices by electrochemical fluidic processing," Opt. Lett. 25, 1285-1287 (2000)

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  1. T. A. Nguty and N. N. Ekere, Circuits Assembly 10, 26 (1999).
  2. J. F. Mack, Hydraul. Pneumat. 50, 43 (1997).
  3. D. M. Taylor, Thin Solid Films 331, 1 (1998).
  4. J. J. Talghader, Proc. SPIE 3286, 86 (1998).
  5. R. G. Sosnowski, E. Tu, W. F. Butler, J. P. O'Connell, and J. M. Heller, Proc. Natl. Acad. Sci. USA 94, 1119 (1997).
  6. M. Ozkan, O. Kibar, C. S. Ozkan, and S. C. Esener, presented at Optics in Computing 2000, Quebec City, Quebec, Canada, June 18–23, 2000.

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