Abstract

A simplified method for planarizing liquid-crystal-on-silicon (LCOS) backplanes is presented. The method relies on the planarizing capability of spin-cast benzocyclobutene (BCB) polymeric resin. BCB planarization shows a sixfold reduction in step height on the surface of a typical LCOS backplane. Contact with the underlying pixel circuitry is made by dry etching through openings in the BCB layer. Reflective metal (87% reflectivity) is deposited over the planarized surface and patterned to form high-aperture-ratio pixel mirrors (84%). An average resistance of 0.75 $\mathrm{\Omega }$ per via was achieved with $3.6-\mathit{\mu }\mathrm{m}$-diameter vias in $2-\mathit{\mu }\mathrm{m}$-thick BCB. The method and the results of this LCOS backplane planarization and postprocessing are described.

© 1997 Optical Society of America

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