Abstract

We describe a novel electrochemical technique for the nonlithographic, fluidic pick-and-place assembly of optoelectronic devices by electrical and optical addressing. An electrochemical cell was developed that consists of indium tin oxide (ITO) and $n$-type silicon substrates as the two electrode materials and deionized water $\left(R=18 \mathrm{M}\mathrm{\Omega }\right)$ as the electrolytic medium between the two electrodes. $0.8–20‐\mathit{\mu }\mathrm{m}‐\mathrm{diameter}$ negatively charged polystyrene beads, $50–100‐\mathit{\mu }\mathrm{m}‐\mathrm{diameter}$ ${\mathrm{SiO}}_2$ pucks, and $50‐\mathit{\mu }\mathrm{m}$ LED’s were successfully integrated upon a patterned silicon substrate by electrical addressing. In addition, $0.8‐\mathit{\mu }\mathrm{m}‐\mathrm{diameter}$ beads were integrated upon a homogeneous silicon substrate by optical addressing. This method can be applied to massively parallel assembly $\left(>1000\times 1000 \mathrm{arrays}\right)$ of multiple types of devices (of a wide size range) with very fast (a few seconds) and accurate positioning.

© 2000 Optical Society of America

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