We analyzed the feasibility of using a UV imprinting process to integrate a microlens array onto an image sensor. A simulated wafer-scale image sensor chip array was fabricated for the implementation. A microlens array with a side length of $4.63\mathrm{\mu }\mathrm{m}$ , a sag height of $1.416\mathrm{\mu }\mathrm{m}$ , and a residual-layer thickness of $1.15\mathrm{\mu }\mathrm{m}$ was integrated onto the simulated image sensor. The standard deviations of the sag height and the residual-layer thickness were less than $0.038\mathrm{\mu }\mathrm{m}$ and less than $0.164\mathrm{\mu }\mathrm{m}$ , respectively, in whole-wafer-scale samples. The measured beam spot size (FWHM) at the imaging plane was $1.19\mathrm{\mu }\mathrm{m}$ , with a uniform intensity distribution and pitch in the array.