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Optics Letters

Optics Letters


  • Editor: Anthony J. Campillo
  • Vol. 31, Iss. 18 — Sep. 15, 2006
  • pp: 2710–2712

Development of an ultraviolet imprinting process for integrating a microlens array onto an image sensor

Seok-min Kim, Hongmin Kim, and Shinill Kang  »View Author Affiliations

Optics Letters, Vol. 31, Issue 18, pp. 2710-2712 (2006)

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We analyzed the feasibility of using a UV imprinting process to integrate a microlens array onto an image sensor. A simulated wafer-scale image sensor chip array was fabricated for the implementation. A microlens array with a side length of 4.63 μ m , a sag height of 1.416 μ m , and a residual-layer thickness of 1.15 μ m was integrated onto the simulated image sensor. The standard deviations of the sag height and the residual-layer thickness were less than 0.038 μ m and less than 0.164 μ m , respectively, in whole-wafer-scale samples. The measured beam spot size (FWHM) at the imaging plane was 1.19 μ m , with a uniform intensity distribution and pitch in the array.

© 2006 Optical Society of America

OCIS Codes
(130.0130) Integrated optics : Integrated optics
(220.0220) Optical design and fabrication : Optical design and fabrication
(220.3630) Optical design and fabrication : Lenses
(220.4610) Optical design and fabrication : Optical fabrication
(230.5160) Optical devices : Photodetectors

ToC Category:
Integrated Optics

Original Manuscript: May 4, 2006
Revised Manuscript: June 24, 2006
Manuscript Accepted: June 24, 2006
Published: August 25, 2006

Seok-min Kim, Hongmin Kim, and Shinill Kang, "Development of an ultraviolet imprinting process for integrating a microlens array onto an image sensor," Opt. Lett. 31, 2710-2712 (2006)

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