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Optics Letters

Optics Letters

| RAPID, SHORT PUBLICATIONS ON THE LATEST IN OPTICAL DISCOVERIES

  • Editor: Alan E. Willner
  • Vol. 33, Iss. 16 — Aug. 15, 2008
  • pp: 1881–1883

Interchip link system using an optical wiring method

In-Kui Cho, Jin-Hwa Ryu, and Myung-Yung Jeong  »View Author Affiliations


Optics Letters, Vol. 33, Issue 16, pp. 1881-1883 (2008)
http://dx.doi.org/10.1364/OL.33.001881


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Abstract

A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.

© 2008 Optical Society of America

OCIS Codes
(060.2280) Fiber optics and optical communications : Fiber design and fabrication
(060.2310) Fiber optics and optical communications : Fiber optics
(130.1750) Integrated optics : Components
(200.4650) Optics in computing : Optical interconnects
(250.3140) Optoelectronics : Integrated optoelectronic circuits
(140.7260) Lasers and laser optics : Vertical cavity surface emitting lasers

ToC Category:
Optoelectronics

History
Original Manuscript: April 3, 2008
Revised Manuscript: June 5, 2008
Manuscript Accepted: June 7, 2008
Published: August 11, 2008

Citation
In-Kui Cho, Jin-Hwa Ryu, and Myung-Yung Jeong, "Interchip link system using an optical wiring method," Opt. Lett. 33, 1881-1883 (2008)
http://www.opticsinfobase.org/ol/abstract.cfm?URI=ol-33-16-1881

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