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Optics Letters

Optics Letters


  • Editor: Alan E. Willner
  • Vol. 33, Iss. 24 — Dec. 15, 2008
  • pp: 2995–2997

Extreme-ultraviolet microexposure tool at 0.5 NA for sub- 16 nm lithography

Michael Goldstein, Russ Hudyma, Patrick Naulleau, and Stefan Wurm  »View Author Affiliations

Optics Letters, Vol. 33, Issue 24, pp. 2995-2997 (2008)

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The resolution limit of present 0.3 NA 13.5 nm wavelength microexposure tools is compared to next-generation lithography research requirements. Findings suggest that a successor design is needed for patterning starting at the 16 nm semiconductor process technology node. A two-mirror 0.5 NA optical design is presented, and performance expectations are established from detailed optical and lithographic simulation. We report on the results from a SEMATECH program to fabricate a projection optic with an ultimate resolution limit of approximately 11 nm .

© 2008 Optical Society of America

OCIS Codes
(110.0110) Imaging systems : Imaging systems
(220.0220) Optical design and fabrication : Optical design and fabrication
(220.3740) Optical design and fabrication : Lithography
(340.0340) X-ray optics : X-ray optics
(340.7480) X-ray optics : X-rays, soft x-rays, extreme ultraviolet (EUV)
(110.4235) Imaging systems : Nanolithography

ToC Category:
Imaging Systems

Original Manuscript: September 10, 2008
Revised Manuscript: October 30, 2008
Manuscript Accepted: November 2, 2008
Published: December 12, 2008

Michael Goldstein, Russ Hudyma, Patrick Naulleau, and Stefan Wurm, "Extreme-ultraviolet microexposure tool at 0.5 NA for sub-16 nm lithography," Opt. Lett. 33, 2995-2997 (2008)

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