Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect
Optics Letters, Vol. 35, Issue 15, pp. 2657-2659 (2010)
http://dx.doi.org/10.1364/OL.35.002657
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Abstract
This Letter presents a solution for locating hot spots in active integrated circuits (IC) and devices. This method is based on sensing the phase lag between the power periodically dissipated by a device integrated in an IC (hot spot) and its corresponding thermal gradient into the chip substrate by monitoring the heat-induced refractive index gradient with a laser beam. The experimental results show a high accuracy and prove the suitability of this technique to locate and characterize devices behaving as hot spots in current IC technologies.
© 2010 Optical Society of America
OCIS Codes
(120.4630) Instrumentation, measurement, and metrology : Optical inspection
(120.5050) Instrumentation, measurement, and metrology : Phase measurement
(120.5710) Instrumentation, measurement, and metrology : Refraction
(120.6810) Instrumentation, measurement, and metrology : Thermal effects
(350.5340) Other areas of optics : Photothermal effects
ToC Category:
Instrumentation, Measurement, and Metrology
History
Original Manuscript: May 12, 2010
Manuscript Accepted: June 21, 2010
Published: July 30, 2010
Citation
Xavier Perpiñà, Josep Altet, Xavier Jordà, Miquel Vellvehi, and Narcís Mestres, "Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect," Opt. Lett. 35, 2657-2659 (2010)
http://www.opticsinfobase.org/ol/abstract.cfm?URI=ol-35-15-2657
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