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Optics Letters

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  • Editor: Alan E. Willner
  • Vol. 35, Iss. 2 — Jan. 15, 2010
  • pp: 184–186

Subsurface microscopy of interconnect layers of an integrated circuit

F. Hakan Köklü and M. Selim Ünlü  »View Author Affiliations


Optics Letters, Vol. 35, Issue 2, pp. 184-186 (2010)
http://dx.doi.org/10.1364/OL.35.000184


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Abstract

We apply the NA-increasing lens technique to confocal and wide-field backside microscopy of integrated circuits. We demonstrate 325 nm ( λ 0 4 ) lateral spatial resolution while imaging metal structures located inside the interconnect layer of an integrated circuit. Vectorial field calculations are presented justifying our findings.

© 2010 Optical Society of America

OCIS Codes
(120.4630) Instrumentation, measurement, and metrology : Optical inspection
(180.1790) Microscopy : Confocal microscopy
(260.2110) Physical optics : Electromagnetic optics
(260.5430) Physical optics : Polarization

ToC Category:
Microscopy

History
Original Manuscript: October 22, 2009
Manuscript Accepted: November 22, 2009
Published: January 13, 2010

Citation
F. Hakan Köklü and M. Selim Ünlü, "Subsurface microscopy of interconnect layers of an integrated circuit," Opt. Lett. 35, 184-186 (2010)
http://www.opticsinfobase.org/ol/abstract.cfm?URI=ol-35-2-184


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References

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