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Optics Letters

| RAPID, SHORT PUBLICATIONS ON THE LATEST IN OPTICAL DISCOVERIES

  • Editor: Alan E. Willner
  • Vol. 38, Iss. 13 — Jul. 1, 2013
  • pp: 2240–2243

Preparation of a YAG:Ce phosphor glass by screen-printing technology and its application in LED packaging

Liang Yang, Mingxiang Chen, Zhicheng Lv, Simin Wang, Xiaogang Liu, and Sheng Liu  »View Author Affiliations


Optics Letters, Vol. 38, Issue 13, pp. 2240-2243 (2013)
http://dx.doi.org/10.1364/OL.38.002240


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Abstract

A simple and practical method for preparing phosphor glass is proposed. Phosphor distribution and element analysis are investigated by optical microscope and field emission scanning electron microscope (FE-SEM). The phosphor particles dispersed in the matrix are vividly observed, and their distributions are uniform. Spectrum distribution and color coordinates dependent on the thickness of the screen-printed phosphor layer coupled with a blue light emitting diode (LED) chip are studied. The luminous efficacy of the 75 μm printed phosphor-layer phosphor glass packaged white LED is 81.24lm/W at 350 mA. This study opens up many possibilities for applications using the phosphor glass on a selected chip in which emission is well absorbed by all phosphors. The screen-printing technique also offers possibilities for the design and engineering of complex phosphor layers on glass substrates. Phosphor screen-printing technology allows the realization of high stability and thermal conductivity for the phosphor layer. This phosphor glass method provides many possibilities for LED packing, including thin-film flip chip and remote phosphor technology.

© 2013 Optical Society of America

OCIS Codes
(220.3630) Optical design and fabrication : Lenses
(230.3670) Optical devices : Light-emitting diodes
(330.1690) Vision, color, and visual optics : Color
(220.4298) Optical design and fabrication : Nonimaging optics

ToC Category:
Optical Devices

History
Original Manuscript: May 2, 2013
Revised Manuscript: May 20, 2013
Manuscript Accepted: May 25, 2013
Published: June 24, 2013

Citation
Liang Yang, Mingxiang Chen, Zhicheng Lv, Simin Wang, Xiaogang Liu, and Sheng Liu, "Preparation of a YAG:Ce phosphor glass by screen-printing technology and its application in LED packaging," Opt. Lett. 38, 2240-2243 (2013)
http://www.opticsinfobase.org/ol/abstract.cfm?URI=ol-38-13-2240


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References

  1. D. F. Feezell, J. S. Speck, S. P. DenBaars, and S. Nakamura, J. Disp. Technol. 9, 190 (2013). [CrossRef]
  2. R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012). [CrossRef]
  3. H. Zhao, G. Liu, J. Zhang, J. D. Poplawsky, V. Dierolf, and N. Tansu, Opt. Express 19, A991 (2011). [CrossRef]
  4. G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013). [CrossRef]
  5. C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013). [CrossRef]
  6. H. C. Kuo, C. W. Hung, H. C. Chen, K. J. Chen, C. H. Wang, C. W. Sher, C. C. Yeh, C. C. Lin, C. H. Chen, and Y. J. Cheng, Opt. Express 19, A930 (2011). [CrossRef]
  7. S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011). [CrossRef]
  8. C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013). [CrossRef]
  9. L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013). [CrossRef]
  10. S. Liu and X. B. Luo, LED Packaging for Lighting Applications: Design, Manufacturing and Testing (Wiley and Chemical Industry, 2011).
  11. L. Yang, Z. C. Lv, M. X. Chen, and S. Liu, in 5th International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, 2012), pp. 1463–1466.
  12. M. H. Chang, D. Das, P. V. Varde, and M. Pecht, Microelectron. Reliab. 52, 762 (2012). [CrossRef]
  13. P. F. Smet, A. B. Parmentier, and D. Poelman, J. Electrochem. Soc. 158, R37 (2011). [CrossRef]
  14. S. Fujita, A. Sakamoto, and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 14, 1387 (2008). [CrossRef]
  15. S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011). [CrossRef]
  16. S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005). [CrossRef]
  17. C. Lucat, P. Ginet, and F. Ménil, J. Microelectron. Electron. Packag. 4, 86 (2007).
  18. H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005). [CrossRef]
  19. N. Narendran and Y. Gu, J. Display Technology 1, 167 (2005). [CrossRef]
  20. M. R. Haskard and R. Malcolm, Thick Film Technology and Applications (Port Erin, Electrochemical Publications, 1997). [CrossRef]
  21. T. Nakanishi and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 15, 1171 (2009). [CrossRef]
  22. C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

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