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Optics Letters

| RAPID, SHORT PUBLICATIONS ON THE LATEST IN OPTICAL DISCOVERIES

  • Editor: Alan E. Willner
  • Vol. 38, Iss. 24 — Dec. 15, 2013
  • pp: 5353–5356

Demonstration of heterogeneous III–V/Si integration with a compact optical vertical interconnect access

Doris Keh Ting Ng, Qian Wang, Jing Pu, Kim Peng Lim, Yongqiang Wei, Yadong Wang, Yicheng Lai, and Seng Tiong Ho  »View Author Affiliations


Optics Letters, Vol. 38, Issue 24, pp. 5353-5356 (2013)
http://dx.doi.org/10.1364/OL.38.005353


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Abstract

Heterogeneous III–V/Si integration with a compact optical vertical interconnect access is fabricated and the light coupling efficiency between the III–V/Si waveguide and the silicon nanophotonic waveguide is characterized. The III–V semiconductor material is directly bonded to the silicon-on-insulator (SOI) substrate and etched to form the III–V/Si waveguide for a higher light confinement in the active region. The compact optical vertical interconnect access is formed through tapering a III–V and an SOI layer in the same direction. The measured III–V/Si waveguide has a light coupling efficiency above 90% to the silicon photonic layer with the tapering structure. This heterogeneous and light coupling structure can provide an efficient platform for photonic systems on chip, including passive and active devices.

© 2013 Optical Society of America

OCIS Codes
(130.3120) Integrated optics : Integrated optics devices
(130.3990) Integrated optics : Micro-optical devices

ToC Category:
Integrated Optics

History
Original Manuscript: September 23, 2013
Revised Manuscript: November 7, 2013
Manuscript Accepted: November 7, 2013
Published: December 9, 2013

Citation
Doris Keh Ting Ng, Qian Wang, Jing Pu, Kim Peng Lim, Yongqiang Wei, Yadong Wang, Yicheng Lai, and Seng Tiong Ho, "Demonstration of heterogeneous III–V/Si integration with a compact optical vertical interconnect access," Opt. Lett. 38, 5353-5356 (2013)
http://www.opticsinfobase.org/ol/abstract.cfm?URI=ol-38-24-5353


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