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Optics Letters

Optics Letters

| RAPID, SHORT PUBLICATIONS ON THE LATEST IN OPTICAL DISCOVERIES

  • Editor: Xi-Cheng Zhang
  • Vol. 39, Iss. 14 — Jul. 15, 2014
  • pp: 4172–4175

Surface and thickness profile measurement of a transparent film by three-wavelength vertical scanning interferometry

Katsuichi Kitagawa  »View Author Affiliations


Optics Letters, Vol. 39, Issue 14, pp. 4172-4175 (2014)
http://dx.doi.org/10.1364/OL.39.004172


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Abstract

We have developed a novel areal film thickness and topography measurement method using three-wavelength interferometry. The method simultaneously estimates the profiles of the front and back surfaces and the thickness distribution of a transparent film by model-based separation of two overlapped signals in an interferogram. The validity of the proposed method is demonstrated using computer simulations and actual experiments.

© 2014 Optical Society of America

OCIS Codes
(120.3180) Instrumentation, measurement, and metrology : Interferometry
(120.3940) Instrumentation, measurement, and metrology : Metrology
(240.0310) Optics at surfaces : Thin films
(310.6860) Thin films : Thin films, optical properties

ToC Category:
Instrumentation, Measurement, and Metrology

History
Original Manuscript: April 25, 2014
Revised Manuscript: June 11, 2014
Manuscript Accepted: June 16, 2014
Published: July 9, 2014

Citation
Katsuichi Kitagawa, "Surface and thickness profile measurement of a transparent film by three-wavelength vertical scanning interferometry," Opt. Lett. 39, 4172-4175 (2014)
http://www.opticsinfobase.org/ol/abstract.cfm?URI=ol-39-14-4172

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