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Optical Materials Express

Optical Materials Express

  • Editor: David J. Hagan
  • Vol. 1, Iss. 4 — Aug. 1, 2011
  • pp: 543–550

Femtosecond laser delamination of thin transparent layers from semiconducting substrates

Tino Rublack and Gerhard Seifert  »View Author Affiliations

Optical Materials Express, Vol. 1, Issue 4, pp. 543-550 (2011)

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Transparent dielectric layers of typically 100 nm thickness can be delaminated from strongly absorbing, semiconducting substrates selectively and without noticeable damage at the opened surface by irradiation with fs laser pulses at photon energies above the semiconductor band gap. We have studied this very special ablation process on silicon wafers coated by SiO2, SixNy and Al2O3, using pulse durations from 50 fs to 2000 fs, and the laser wavelengths 1030, 800, 515, and 400 nm. By help of a precise determination of ablation thresholds and detailed inspection of ablation craters by optical and atomic force microscopy, we conclude that a very short penetration depth of the laser light due to charge carriers generated in the silicon by the pulse itself is the key for the quasi damage-free delamination process.

© 2011 OSA

OCIS Codes
(310.0310) Thin films : Thin films
(320.7130) Ultrafast optics : Ultrafast processes in condensed matter, including semiconductors
(350.3390) Other areas of optics : Laser materials processing

ToC Category:
Thin Films

Original Manuscript: June 2, 2011
Revised Manuscript: June 30, 2011
Manuscript Accepted: July 1, 2011
Published: July 6, 2011

Virtual Issues
Femtosecond Direct Laser Writing and Structuring of Materials (2011) Optical Materials Express

Tino Rublack and Gerhard Seifert, "Femtosecond laser delamination of thin transparent layers from semiconducting substrates [Invited]," Opt. Mater. Express 1, 543-550 (2011)

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