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Optical Materials Express

Optical Materials Express

  • Editor: David J. Hagan
  • Vol. 2, Iss. 8 — Aug. 1, 2012
  • pp: 1141–1148

Self-assembled monolayer assisted bonding of Si and InP

I. Bakish, V. Artel, T. Ilovitsh, M. Shubely, Y. Ben-Ezra, A. Zadok, and C. N. Sukenik  »View Author Affiliations

Optical Materials Express, Vol. 2, Issue 8, pp. 1141-1148 (2012)

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A versatile procedure for the low-temperature bonding of silicon and indium-phosphide to silicon is proposed and demonstrated. The procedure relies on the deposition and functionalization of self-assembled, single molecular layers on the surface of one substrate, and the subsequent attachment of the monolayer to the surface of the other substrate with or without its own monolayer coating. The process is applicable to the fabrication of hybrid-silicon, active photonic devices.

© 2012 OSA

OCIS Codes
(130.3130) Integrated optics : Integrated optics materials
(160.6000) Materials : Semiconductor materials
(230.3120) Optical devices : Integrated optics devices

ToC Category:
Materials for Integrated Optics

Original Manuscript: July 2, 2012
Revised Manuscript: July 25, 2012
Manuscript Accepted: July 25, 2012
Published: July 26, 2012

I. Bakish, V. Artel, T. Ilovitsh, M. Shubely, Y. Ben-Ezra, A. Zadok, and C. N. Sukenik, "Self-assembled monolayer assisted bonding of Si and InP," Opt. Mater. Express 2, 1141-1148 (2012)

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