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Optical Materials Express

Optical Materials Express

  • Editor: David J. Hagan
  • Vol. 3, Iss. 1 — Jan. 1, 2013
  • pp: 35–46

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens  »View Author Affiliations

Optical Materials Express, Vol. 3, Issue 1, pp. 35-46 (2013)

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Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one of the most promising methods for the fabrication of active photonic devices in silicon photonics. For this integration, it is essential to have a reliable and robust bonding procedure, which also provides a uniform and ultra-thin bonding layer for an effective optical coupling between III-V active layers and SOI waveguides. A new process for bonding of III-V dies to processed silicon-on-insulator waveguide circuits using divinylsiloxane-bis-benzocyclobutene (DVS-BCB) was developed using a commercial wafer bonder. This “cold bonding” method significantly simplifies the bonding preparation for machine-based bonding both for die and wafer-scale bonding. High-quality bonding, with ultra-thin bonding layers (<50 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers.

© 2012 OSA

OCIS Codes
(130.3130) Integrated optics : Integrated optics materials
(250.3140) Optoelectronics : Integrated optoelectronic circuits

ToC Category:
Materials for Integrated Optics

Original Manuscript: October 24, 2012
Revised Manuscript: December 3, 2012
Manuscript Accepted: December 3, 2012
Published: December 11, 2012

S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens, "Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate," Opt. Mater. Express 3, 35-46 (2013)

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