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Optical Materials Express

Optical Materials Express

  • Editor: David J. Hagan
  • Vol. 3, Iss. 1 — Jan. 1, 2013
  • pp: 35–46

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens  »View Author Affiliations


Optical Materials Express, Vol. 3, Issue 1, pp. 35-46 (2013)
http://dx.doi.org/10.1364/OME.3.000035


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Abstract

Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one of the most promising methods for the fabrication of active photonic devices in silicon photonics. For this integration, it is essential to have a reliable and robust bonding procedure, which also provides a uniform and ultra-thin bonding layer for an effective optical coupling between III-V active layers and SOI waveguides. A new process for bonding of III-V dies to processed silicon-on-insulator waveguide circuits using divinylsiloxane-bis-benzocyclobutene (DVS-BCB) was developed using a commercial wafer bonder. This “cold bonding” method significantly simplifies the bonding preparation for machine-based bonding both for die and wafer-scale bonding. High-quality bonding, with ultra-thin bonding layers (<50 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers.

© 2012 OSA

OCIS Codes
(130.3130) Integrated optics : Integrated optics materials
(250.3140) Optoelectronics : Integrated optoelectronic circuits

ToC Category:
Materials for Integrated Optics

History
Original Manuscript: October 24, 2012
Revised Manuscript: December 3, 2012
Manuscript Accepted: December 3, 2012
Published: December 11, 2012

Citation
S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens, "Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate," Opt. Mater. Express 3, 35-46 (2013)
http://www.opticsinfobase.org/ome/abstract.cfm?URI=ome-3-1-35


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References

  1. W. Bogaerts, R. Baets, P. Dumon, V. Wiaux, S. Beckx, D. Taillaert, B. Luyssaert, J. Van Campenhout, P. Bienstman, and D. Van Thourhout, “Nanophotonic waveguides in silicon-on-insulator fabricated with CMOS technology,” J. Lightwave Technol.23(1), 401–412 (2005). [CrossRef]
  2. O. Boyraz and B. Jalali, “Demonstration of a silicon Raman laser,” Opt. Express12(21), 5269–5273 (2004). [CrossRef] [PubMed]
  3. G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intera-chip optical interconnects,” Laser Photonics Rev.4(6), 751–779 (2010). [CrossRef]
  4. D. Liang and J. E. Bowers, “Recent progress in lasers on silicon,” Nat. Photonics4(8), 511–517 (2010). [CrossRef]
  5. T. Mitze, M. Schnarrenberger, L. Zimmermann, J. Bruns, F. Fidorra, J. Kreissl, K. Janiak, S. Fidorra, H. Heidrich, and K. Petermann, “Hybrid integration of III/V lasers on a silicon-on-insulator (SOI) optical board,” in 2nd IEEE International Conference on Group IV Photonics,2005 (IEEE, 2005), pp. 210–212.
  6. D. Fehly, A. Schlachetzki, A. S. Bakin, A. Guttzeit, and H.-H. Wehmann, “Monolithic InGaAsP optoelectronic devices with silicon electronics,” IEEE J. Sel. Top. Quantum Electron.37(10), 1246–1252 (2001). [CrossRef]
  7. M. Lamponi, S. Keyvaninia, C. Jany, F. Poingt, F. Lelarge, G. de Valicourt, G. Roelkens, D. Van Thourhout, S. Messaoudene, J.-M. Fedeli, and G. H. Duan, “Low-threshold heterogeneously integrated InP/SOI lasers with a double adiabatic taper coupler,” IEEE Photon. Technol. Lett.24(1), 76–78 (2012). [CrossRef]
  8. S. Stanković, R. Jones, J. Heck, M. Sysak, D. Van Thourhout, and G. Roelkens, “Die-to-die adhesive bonding for evanescently-coupled photonic devices,” Electrochem. Solid-State Lett.14(8), H326–H329 (2011). [CrossRef]
  9. S. Palit, J. Kirch, G. Tsvid, L. Mawst, T. Kuech, and N. M. Jokerst, “Low-threshold thin-film III-V lasers bonded to silicon with front and back side defined features,” Opt. Lett.34(18), 2802–2804 (2009). [CrossRef] [PubMed]
  10. S. Famenini and C. G. Fonstad, “Integration of edge-emitting laser diodes with dielectric waveguides on silicon,” IEEE Photon. Technol. Lett.24(20), 1849–1851 (2012). [CrossRef]
  11. F. J. Blanco, M. Agirregabiria, J. Garcia, J. Berganzo, M. Tijero, M. T. Arroyo, J. M. Ruano, I. Aramburu, and K. Mayora, “Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding,” J. Micromech. Microeng.14(7), 1047–1056 (2004). [CrossRef]
  12. H. C. Lin, K. L. Chang, G. W. Pickrell, K. C. Hsieh, and K. Y. Cheng, “Low temperature wafer bonding by spin on glass,” J. Vac. Sci. Technol. B20(2), 752–754 (2002). [CrossRef]
  13. F. Niklaus, P. Enoksson, E. Kalvesten, and G. Stemme, “Low-temperature full wafer adhesive bonding,” J. Micromech. Microeng.11(2), 100–107 (2001). [CrossRef]
  14. D.-H. Choi, C.-H. Yeo, J.-T. Kim, C.-W. Ok, J.-S. Kim, Y. Kwon, and Y.-H. Im, “Study on bisbenzocyclobutene bonding for the development of a si-based miniaturized reformer of fuel cell systems,” J. Micromech. Microeng.19(7), 075013 (2009). [CrossRef]
  15. F. Niklaus, G. Stemme, J.-Q. Lu, and R. J. Gutmann, “Adhesive wafer bonding,” J. Appl. Phys.99(3), 031101 (2006). [CrossRef]
  16. S. Keyvaninia, M. Muneeb, S. Stankovic, G. Roelkens, D. Van Thourhout, and J.-M. Fedeli, “Multiple die-to-wafer adhesive bonding for heterogeneous integration,” in 16th European Conference on Integrated Optics (2012), paper 186.
  17. S. Stanković, R. Jones, M. Sysak, J. Heck, G. Roelkens, and D. Van Thourhout, “1310nm Hybrid III-V/Si Fabry-Perot Laser Based on Adhesive Bonding,” IEEE Photon. Technol. Lett.23(23), 1781–1783 (2011). [CrossRef]
  18. S. Keyvaninia, G. Roelkens, and D. Van Thourhout, “Engineering the heterogeneously integrated III-V/SOI tunable laser,” in Proceedings of 2009Annual Symposium of the IEEE Photonics Benelux Chapte r(ASP—Academic & Scientific, 2009), pp. 141–144.
  19. S. Keyvaninia, S. Verstuyft, F. Lelarge, G. H. Duan, S. Messaoudene, J. M. Fedeli, T. De Vries, B. Smalbrugge, J. Bolk, M. Smit, D. Van Thourhout, and G. Roelkens, “Heterogeneously integrated III-V/Si multi-wavelength laser based on a ring resonator array multiplexer,” in Asia Communications and Photonics Conference, OSA Technical Digest (Optical Society of America, 2012), paper PAF4A.3.
  20. D. Van Thourhout, S. Keyvaninia, G. Roelkens, M. Lamponi, F. Lelarge, J. M. Fedeli, S. Messaoudene, and G. H. Duan, “Optimization of taper structures for III-V silicon lasers,” in 2012 International Conference on Solid State Devices and Materials (2012), pp. 524–525.
  21. P. De Heyn, S. Verstuyft, S. Keyvaninia, A. Trita, and D. Van Thourhout, “Tunable 4-channel ultra-dense WDM demultiplexer with III-V photodiodes integrated on silicon-on-insulator,” in Asia Communications and Photonics Conference, OSA Technical Digest (Optical Society of America, 2012), paper ATh2B.1.
  22. “Processing procedures for CYCLOTENE 3000 series dry etch resins,” http://www.dow.com/cyclotene/prod/302235.htm .
  23. J. Pello, P. Saboya, S. Keyvaninia, J. J. G. M. van der Tol, G. Roelkens, H. P. M. M. Ambrosius, and M. K. Smit, “Post-bonding fabrication of photonic devices in an Indium phosphide membrane bonded on glass,” in Proceedings of the 16th Annual symposium of the IEEE Photonics Benelux Chapter (2011), pp. 213–216.
  24. J. Pello, J. van der Tol, S. Keyvaninia, R. van Veldhoven, H. Ambrosius, G. Roelkens, and M. Smit, “High-efficiency ultrasmall polarization converter in InP membrane,” Opt. Lett.37(17), 3711–3713 (2012). [CrossRef] [PubMed]

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