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Optoelectronic Packaging for Optical Interconnects

Sing H. Lee and Y.C. Lee

Optics and Photonics News, Vol. 17, Issue 1, pp. 40-45 (2006)
http://dx.doi.org/10.1364/OPN.17.1.000040


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Abstract

Optoelectronic packages provide a platform for integrating photonic, optoelectronic and electronic devices for the transmission of optical signals in telecommunication and computing networks. The authors describe current technologies and future possibilities.

© 2005 Optical Society of America

OCIS Codes
(220.0220) Optical design and fabrication : Optical design and fabrication
(250.0250) Optoelectronics : Optoelectronics

Citation
Sing H. Lee and Y.C. Lee, "Optoelectronic Packaging for Optical Interconnects," Optics & Photonics News 17(1), 40-45 (2006)
http://www.opticsinfobase.org/opn/abstract.cfm?URI=opn-17-1-40


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