OSA's Digital Library

Photonics Research

Photonics Research

| A joint OSA/Chinese Laser Press publication

  • Editor: Zhiping (James) Zhou
  • Vol. 2, Iss. 3 — Jun. 1, 2014
  • pp: A1–A7

High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]

Yutaka Urino, Tatsuya Usuki, Junichi Fujikata, Masashige Ishizaka, Koji Yamada, Tsuyoshi Horikawa, Takahiro Nakamura, and Yasuhiko Arakawa  »View Author Affiliations


Photonics Research, Vol. 2, Issue 3, pp. A1-A7 (2014)
http://dx.doi.org/10.1364/PRJ.2.0000A1


View Full Text Article

Enhanced HTML    Acrobat PDF (1153 KB)





Browse Journals / Lookup Meetings

Browse by Journal and Year


   


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools

Share
Citations

Abstract

One of the most serious challenges facing exponential performance growth in the information industry is the bandwidth bottleneck in interchip interconnects. We propose a photonics–electronics convergence system in response to this issue. To demonstrate the feasibility of the system, we fabricated a silicon optical interposer integrated with arrayed laser diodes, spot-size converters, optical splitters, optical modulators, photodetectors, and optical waveguides on a single silicon substrate. Using this system, 20 Gbps error-free data links and a 30Tbps/cm2 bandwidth density were achieved. This bandwidth density is sufficient to meet the interchip interconnect requirements for the late 2010s.

© 2014 Chinese Laser Press

OCIS Codes
(130.3120) Integrated optics : Integrated optics devices
(200.4650) Optics in computing : Optical interconnects
(230.0250) Optical devices : Optoelectronics

History
Original Manuscript: January 14, 2014
Revised Manuscript: February 26, 2014
Manuscript Accepted: February 27, 2014
Published: April 11, 2014

Citation
Yutaka Urino, Tatsuya Usuki, Junichi Fujikata, Masashige Ishizaka, Koji Yamada, Tsuyoshi Horikawa, Takahiro Nakamura, and Yasuhiko Arakawa, "High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]," Photon. Res. 2, A1-A7 (2014)
http://www.opticsinfobase.org/prj/abstract.cfm?URI=prj-2-3-A1


Sort:  Author  |  Year  |  Journal  |  Reset  

References

  1. I. A. Young, E. M. Mohammed, J. T. S. Liao, A. M. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical technology for energy efficient I/O in high performance computing,” IEEE Commun. Mag. 48(10), 184–191 (2010). [CrossRef]
  2. International Technology Roadmap for Semiconductors 2009 Edition, Assembly and Packaging, Table AP2 and AP3, http://www.itrs.net/Links/2009ITRS/2009Chapters_2009Tables/2009Tables_FOCUS_E_ITRS.xls .
  3. L. Chen, K. Preston, S. Manipatruni, and M. Lipson, “Integrated GHz silicon photonic interconnect with micrometer-scale modulators and detectors,” Opt. Express 17, 15248–15256 (2009). [CrossRef]
  4. K. Raj, J. E. Cunningham, R. Ho, X. Zheng, H. Schwetman, P. Koka, M. McCracken, J. Lexau, G. Li, H. Thacker, I. Shubin, Y. Luo, J. Yao, M. Asghari, T. Pinguet, J. Mitchell, and A. V. Krishnamoorthy, “‘Macrochip’ computer systems enabled by silicon photonic interconnects,” Proc. SPIE 7607, 760702 (2010). [CrossRef]
  5. G. Kim, J. W. Park, I. G. Kim, S. Kim, S. Kim, J. M. Lee, G. S. Park, J. Joo, K. S. Jang, J. H. Oh, S. A. Kim, J. H. Kim, J. Y. Lee, J. M. Park, D. W. Kim, D. K. Jeong, M. S. Hwang, J. K. Kim, K. S. Park, H. K. Chi, H. C. Kim, D. W. Kim, and M. H. Cho, “Low-voltage high-performance silicon photonic devices and photonic integrated circuits operating up to 30  Gb/s,” Opt. Express 19, 26936–26947 (2011). [CrossRef]
  6. Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011). [CrossRef]
  7. X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (On-Chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24, 1260–1262 (2012). [CrossRef]
  8. R. E. Camacho-Aguilera, Y. Cai, N. Patel, J. T. Bessette, M. Romagnoli, L. C. Kimerling, and J. Michel, “An electrically pumped germanium laser,” Opt. Express 20, 11316–11320 (2012). [CrossRef]
  9. A. W. Fang, H. Park, O. Cohen, R. Jones, M. J. Paniccia, and J. E. Bowers, “Electrically pumped hybrid AlGaInAs-silicon evanescent laser,” Opt. Express 14, 9203–9210 (2006). [CrossRef]
  10. T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceedings of IEEE International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.
  11. N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “2.2  pJ/bit operation of hybrid integrated light source on a silicon optical interposer for optical interconnection,” in Proceedings of IEEE Photonic Conference (IEEE, 2013), pp. 254–255.
  12. Y. Arakawa, T. Nakamura, Y. Urino, and T. Fujita, “Silicon photonics for next generation system integration platform,” IEEE Commun. Mag. 51(3), 72–77 (2013). [CrossRef]
  13. N. Hirayama, H. Takahashi, Y. Noguchi, M. Yamagishi, and T. Horikawa, “Low-loss Si waveguides with variable-shaped-beam EB lithography for large-scaled photonic circuits,” in Extended Abstracts of the International Conference on Solid State Devices and Materials (JSAP, 2012), pp. 530–531.
  14. L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40  Gbit/s silicon optical modulator for high speed applications,” Electron. Lett. 43, 1196–1197 (2007). [CrossRef]
  15. D. J. Thomson, F. Y. Gardes, Y. Hu, G. Mashanovich, M. Fournier, P. Grosse, J.-M. Fedeli, and G. T. Reed, “High contrast 40  Gb/s optical modulation in silicon,” Opt. Express 19, 11507–11516 (2011). [CrossRef]
  16. P. Dong, L. Chen, and Y.-k. Chen, “High-speed low-voltage single-drive push-pull silicon Mach–Zehnder modulators,” Opt. Express 20, 6163–6169 (2012). [CrossRef]
  17. S. Akiyama, T. Baba, M. Imai, T. Akagawa, M. Takahashi, N. Hirayama, H. Takahashi, Y. Noguchi, H. Okayama, T. Horikawa, and T. Usuki, “12.5-Gb/s operation with 0.29-V•cm VπL using silicon Mach–Zehnder modulator based-on forward-biased pin diode,” Opt. Express 20, 2911–2923 (2012). [CrossRef]
  18. J. Fujikata, M. Miura, M. Noguchi, D. Okamoto, T. Horikawa, and Y. Arakawa, “Si waveguide-integrated metal–semiconductor–metal and p-i-n-type Ge photodiodes using Si-capping layer,” Jpn. J. Appl. Phys. 52, 04CG10 (2013). [CrossRef]
  19. N. Fujioka, T. Chu, and M. Ishizaka, “Compact and low power consumption hybrid integrated wavelength tunable laser module using silicon waveguide resonators,” J. Lightwave Technol. 28, 3115–3120 (2010).
  20. N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A novel spot size convertor for hybrid integrated light sources on photonics-electronics convergence system,” in Proceedings of IEEE International Conference on Group IV Photonics (IEEE, 2012), pp. 171–173.
  21. N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Lightwave Technol. 32, 1329–1336 (2014). [CrossRef]
  22. S. Akiyama, M. Imai, T. Baba, T. Akagawa, N. Hirayama, Y. Noguchi, M. Seki, K. Koshino, M. Toyama, T. Horikawa, and T. Usuki, “Compact PIN-diode-based silicon modulator using side-wall-grating waveguide,” IEEE J. Sel. Top. Quantum Electron. 19, 74–84 (2013). [CrossRef]
  23. H. Okayama, D. Shimura, H. Takahashi, M. Seki, M. Toyama, T. Sano, K. Koshino, N. Yokoyama, M. Ohtsuka, A. Sugiyama, S. Ishitsuka, T. Tsuchizawa, H. Nishi, K. Yamada, H. Yaegashi, T. Horikawa, and H. Sasaki, “Si wire array waveguide grating with parallel star coupler configuration fabricated by ArF excimer immersion lithography,” Electron. Lett. 49, 410–412 (2013). [CrossRef]
  24. S. H. Jeong, D. Shimura, T. Simoyama, M. Seki, N. Yokoyama, M. Ohtsuka, K. Koshino, T. Horikawa, Y. Tanaka, and K. Morito, “Low-loss, flat-topped and spectrally uniform silicon-nanowire-based 5th-order CROW fabricated by ArF-immersion lithography process on a 300-mm SOI wafer,” Opt. Express 21, 30163–30174 (2013). [CrossRef]

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.


« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited