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Photonics Research Feature Announcement

Integrated Photonics: challenges and perspectives (invited only)

Submission Deadline: 15 April 2015

Photonics Research is organizing a special issue to discuss some challenges and perspectives for integrated photonics. Integrated Photonics has achieved great success since Dr. Stewart E. Miller proposed to combine multiple optical components onto one semiconductor chip in 1969. Various materials and technologies have been developed to realize photonic integrated circuits for many applications. Large-scale photonic integrated circuits (LS-PICs) are becoming a very promising technology to improve performance, reduce device footprints, lower costs, and lower power consumption. However, the progress on LS-PICs is still quite limited. One reason is that the material system for photonics is much more complex than for electronics. Traditionally, InP is regarded as a platform for PICs since both passive and active components can be enabled on the same substrate. In recent years, silicon-based PICs have become very popular and promising for LS-PICs because of their compatibility with mature CMOS technologies with excellent processing control, low cost, and high volume processing. Furthermore, ultra-compact silicon photonic integrated devices can be realized due to the ultra-high index contrast. However, silicon is not a direct bandgap semiconductor material, and thus it is unsuitable for active components such as lasers and photodetectors, but heterogeneous integration by combining different materials provides a possible solution.

Topics of interest include but are not limited to:

  • High-performance photonic integrated devices: lasers, photodetectors, modulators, (de)multiplexers, couplers
  • Opto-mechanic devices
  • Monolithic integration
  • Hybrid integration
  • III-V photonic integration
  • Silicon photonic integration
  • Mid-IR photonic integration
  • Large-scale photonic integration
  • Quantum photonic integrated circuits

Manuscripts should be prepared according to the usual standards for submission to Photonics Research; see the OSA Style Guide. Manuscripts must also be uploaded through OSA's electronic submission system. Please specify that the manuscript is for the Integrated Photonics: challenges and perspectives feature issue (choose from the feature issue drop-down menu). Manuscripts will undergo the same peer review as other papers submitted to the Journal. The standard Photonics Research article processing charges will apply.

Feature Issue Editors

Daoxin Dai, Zhejiang University, China (Lead Editor)

Di Liang, HP Labs, USA

Liu Liu, South China Normal University, China