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Optics Letters

Optics Letters


  • Editor: Alan E. Willner
  • Vol. 38, Iss. 15 — Aug. 1, 2013
  • pp: 2632–2635

Combining wet etching and real-time damage event imaging to reveal the most dangerous laser damage initiator in fused silica

Guohang Hu, Yuanan Zhao, Xiaofeng Liu, Dawei Li, Qiling Xiao, Kui Yi, and Jianda Shao  »View Author Affiliations

Optics Letters, Vol. 38, Issue 15, pp. 2632-2635 (2013)

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A reliable method, combining a wet etch process and real-time damage event imaging during a raster scan laser damage test, has been developed to directly determine the most dangerous precursor inducing low-density laser damage at 355 nm in fused silica. It is revealed that 16% of laser damage sites were initiated at the place of the scratches, 49% initiated at the digs, and 35% initiated at invisible defects. The morphologies of dangerous scratches and digs were compared with those of moderate ones. It is found that local sharp variation at the edge, twist, or inside of a subsurface defect is the most dangerous laser damage precursor.

© 2013 Optical Society of America

OCIS Codes
(140.3330) Lasers and laser optics : Laser damage
(140.3380) Lasers and laser optics : Laser materials
(140.3440) Lasers and laser optics : Laser-induced breakdown

ToC Category:
Lasers and Laser Optics

Original Manuscript: May 10, 2013
Revised Manuscript: June 18, 2013
Manuscript Accepted: June 25, 2013
Published: July 18, 2013

Guohang Hu, Yuanan Zhao, Xiaofeng Liu, Dawei Li, Qiling Xiao, Kui Yi, and Jianda Shao, "Combining wet etching and real-time damage event imaging to reveal the most dangerous laser damage initiator in fused silica," Opt. Lett. 38, 2632-2635 (2013)

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